Aluminum compounds and methods of forming aluminum- containing film using the same
US11912728B2 · kind B2 · utility
1Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Jan 25, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45553
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure relates to a novel aluminum-containing compound, a method of preparing the aluminum-containing compound, a precursor composition for forming a film including the aluminum-containing precursor compound, and a method of forming an aluminum-containing film using the precursor composition for forming a film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.