Polyethylene composition for film applications
US11912838B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 26, 2019 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Oct 26, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2353/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a polyethylene composition comprising a base resin comprising a low molecular weight ethylene polymer component and a high molecular weight ethylene polymer component, wherein the high molecular weight ethylene polymer component has a higher weight average molecular weight than the low molecular weight ethylene polymer component, wherein the base resin has a density of at least 958.0 kg/m3, and the polyethylene composition a melt flow rate MFR2 (190° C., 2.16 kg) of from 0.50 to 0.80 g/10 min and a molecular weight distribution being the ratio of the weight average molecular weight and the number average molecular weight, Mw/Mn, of from 10.0 to 15.0, a process for producing said polyethylene composition, an article comprising said polyethylene composition and the use of said polyethylene composition for the production of a film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.