Step-wise fabrication of conductive carbon nanotube bridges via dielectrophoresis
US11912900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Apr 6, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Carbon nanotube (CNT) agglomerates can be aligned along the field lines between adjacent electrodes to form conductive bridges. The present invention is directed to a stepwise process of dielectrophoretic deposition of CNTs to form conducting bridges between adjacent electrodes spanning lengths over 50 microns. The CNT bridges are permanently secured using electrodeposition of the conducting polymer polypyrrole. Morphologies of the CNT bridges formed within a frequency range of 1 kHz and 10 MHz are employed and explained as a consequence of interplay between dielectrophoretic and electroosmotic forces. Postdeposition heat treatment increases conductivity of CNT bridges likely due to solvent evaporation and resulting surface tension inducing better contact between CNTs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.