Surface pattern forming method for aluminium product
US11913122B2 · kind B2 · utility
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1Claims
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Key dates
| Filing date | Dec 1, 2020 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Dec 1, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D11/246
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A pattern forming method is disclosed. The pattern forming method includes buffing a surface of a product containing aluminum, masking at least a part of the buffed surface with an etching resist, etching a part of the buffed surface not masked by the etching resist, removing the etching resist from the surface, and anodizing the surface from which the etching resist is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.