Heat pump system
US11913694B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2018 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Aug 4, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2700/21151
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump system includes a refrigerant circuit in which a compressor, a refrigerant flow path included in a heat medium heat exchanger, an expansion valve, and a heat source side heat exchanger are connected, the heat medium heat exchanger including the refrigerant flow path and a heat medium flow path; a heat medium feed path connected to the heat medium flow path included in the heat medium heat exchanger; an indoor unit connected to the heat medium feed path and configured to condition air inside a room; a room temperature sensor configured to detect an indoor temperature in the room; a heat medium temperature sensor configured to detect a temperature of a heat medium that flows into the indoor unit; and a controller configured to control the refrigerant circuit or the indoor unit by using a set temperature in the room.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.