Non-destructive gap metrology
US11913772B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Mar 17, 2022 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Mar 17, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.