Methods and apparatus for improved thermal monitoring by correlating infrared emissivity to surface topography
US11913839B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2020 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | May 21, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Embodiments of the present disclosure provide an improved method and apparatus for thermal monitoring for a metal additive manufacturing system. An emissivity value of a top surface of an object to be manufactured is determined based, at least in part, on an arithmetic product of a predetermined roughness value and a predetermined slope-related value. The predetermined roughness value and slope-related values are predetermined based, at least in part, on measurements of a previously manufactured object. The system sinters a metal to form the top surface of the object to be manufactured. An infrared sensor detects radiation from at least a portion of the top surface of the object to be manufactured. A temperature is generated based, at least in part, on the detected infrared radiation and the emissivity value and the generated temperature is applied to a temperature utilization component of the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.