Digital immunochip and manufacture method of the same
US11913947B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Dec 7, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01L2300/165
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides a digital immunochip and a manufacture method thereof. The digital immunochip includes a first substrate and a second substrate which are opposite to each other. The first substrate includes: a first base substrate; at least one driving electrode on the first base substrate and configured to drive an object to be detected to move; a dielectric layer on a side of the at least one driving electrode away from the first base substrate and covering the at least one driving electrode; and a first hydrophobic layer on a side of the dielectric layer away from the first base substrate. The second substrate includes: a second base substrate; and an immunoassay substance on a side of the second base substrate proximal to the first hydrophobic layer of the first substrate and including an antigen or an antibody.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.