Reliability evaluation method and system of microgrid inverter IGBT based on segmented LSTM
US11913986B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Jun 29, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/04
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A reliability evaluation method and system for a microgrid inverter IGBT based on segmented long short-term memory (LSTM) is disclosed, including steps as follows. An electrothermal coupling model is constructed to obtain real-time junction temperature data. The original LSTM algorithm is improved to obtain a segmented LSTM prediction network for the aging characteristics of the IGBT. The monitoring value of the IGBT aging parameter is used to perform segmented LSTM prediction to obtain the predicted aging process, and the threshold values of different aging stages are categorized. An aging correction is performed on the aging parameter of the electrothermal coupling model to ensure the accuracy of the junction temperature data. Rainflow-counting algorithm is used to calculate real-time thermal stress load distribution of the IGBT. The fatigue damage theory and the Lesit life prediction model are combined to calculate the real-time cumulative damage and predicted life of the IGBT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.