Predicting on chip transient thermal response in a multi-chip system using an RNN-based predictor
US11914931B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2019 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Oct 23, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. The methods can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC); performing a thermal simulation for each respective template of the IC based on a sequence of power patterns of tiles of the respective template; and training a neural network with a plurality of training data collected via thermal simulations performed for the templates of the IC. These systems and methods can use a machine learning predictor, that has been trained to determine a transient temperature rise across an entire IC, and then append the determined transient temperature rise to a system level thermal profile of the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.