Optimized process for graphic personalization of chip-card modules and obtained module
US11915082B2 · kind B2 · utility
0Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Mar 17, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07747
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Provided is a process for manufacturing a standard chip-card module comprising metallized contacts (P1-P6) defining a graphic design comprising visible parts formed from lines, segments or dots, a first portion (2A, 12A) of which passes right through the thickness of the metallized contacts (P1-P6) and a second portion (2B, 12B) of which is formed only superficially on the upper external surface of the metallized contacts (P1-P6). The second portion (2A, 12A) is produced in the continuity of the first portion, to form said graphic design. Other embodiments directed to a module resulting from the process is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.