Multilayer ceramic electronic component
US11915877B2 · kind B2 · utility
1Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2023 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Mar 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.