Multilayer electronic component including side margin portion having composition gradient across thickness thereof
US11915880B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Oct 12, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Jan 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1209
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a body including a plurality of dielectric layers, side margin portions disposed on the body, and external electrodes disposed on the body. The reliability of the multilayer electronic component is improved by controlling the contents of Si for each position of the dielectric layer and the side margin portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.