Ceramic semiconductor device package with copper tungsten conductive layers
US11915986B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2022 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Feb 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/36
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A described example includes: a ceramic package having a board side surface and an opposite top side surface; a heat slug mounted to the board side surface of the ceramic package, forming a bottom surface in a die cavity; leads mounted to conductive lands on the ceramic package; sidewall metallization extending from the conductive lands and covering a portion of one of the sides of the ceramic package; copper tungsten alloy conductor layers formed in the ceramic package and spaced by dielectric layers; bond fingers formed of a conductor layer and extending to the die cavity; a semiconductor device mounted over the heat slug, and having bond pads on a device side surface facing away from a surface of the heat slug; electrical connections between bond pads on the semiconductor device and the bond fingers; and a lid mounted to the top side surface of the ceramic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.