Vacuum deposition system and method thereof
US11916036B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Jul 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method are provided for depositing a substance onto a substrate, the system comprising: a chamber adapted to operate under high vacuum; an apparatus for receiving and cleaning the substrate to produce a clean substrate and for delivering the clean substrate to a coating position in the chamber under high vacuum; a carrier assembly for receiving the clean substrate from the apparatus and for retaining the substrate at the coating position; an evaporator adapted to hold a supply of the substance in the chamber and to evaporate and produce a discharge of the substance; and a collimator disposed within the chamber between the supply of the substance and the carrier assembly, the collimator being configured to define an aperture proximal to the substrate and to capture the discharge but for that which is directed through the aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.