Optoelectronic package having second encapsulant cover first encapsulant and photonic devices
US11916155B2 · kind B2 · utility
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1References
12Claims
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Key dates
| Filing date | May 21, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Dec 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/933
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.