Assemblies for reducing passive intermodulation in telecommunications structures
US11916278B2 · kind B2 · utility
0Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Oct 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/1242
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present disclosure describes a telecommunications structure. The telecommunications structure includes an antenna frame including a plurality of horizontal members and a plurality of vertical members mounted on the horizontal members, wherein one or more of the vertical members are formed of a fiber-reinforced polymer and at least one piece of telecommunications equipment mounted on one of the fiber-reinforced polymer vertical members. Assemblies including passive intermodulation reducing mechanical connections are also described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.