Wiring board and method for manufacturing wiring board
US11916285B2 · kind B2 · utility
0Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2019 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Sep 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1338
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board (10) includes a substrate (11) that is transparent and a wiring pattern region (20) that is disposed on the substrate (11) and that includes a plurality of wiring lines (21, 22). The wiring pattern region (20) has a sheet resistance of less than or equal to 5 Ω/sq, and each wiring line (21, 22) has a maximum width of less than or equal to 3 μm when viewed at a viewing angle of 120°.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.