Patent · US Active

Method for manufacturing a camera module, camera module

US11917274B2 · kind B2 · utility

0Cited by

0References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Gerald Brinks · Burgrieden, DE
Guenter Escher · Oberstdorf, DE
Matthias Pohl · Oberursel, DE
Peter Diesel · Dewitt Court, DE

Key dates

Filing date	Jul 30, 2021
Grant date	Feb 27, 2024
Priority date	—
Expiry date	Mar 1, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/30
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for manufacturing a camera module. The method includes: a) mounting an image sensor on a circuit board, b) inserting and fixing the circuit board into a housing, c) aligning an objective lens accommodated in the housing and including an electrical interface with respect to the image sensor, d) fixing the objective lens in the housing. In step b) spring contacts, which are movable with respect to the circuit board, are inserted into the housing together with the circuit board and, in a step e), i.e., after the fixation of the objective lens in the housing, are brought into contact with the electrical interface with the aid of clamping and/or fixing elements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.