Circuit board for use at 5G frequencies
US11917753B2 · kind B2 · utility
0Cited by
129References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2020 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Apr 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10522
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laminate for use in a circuit board is provided. The laminate comprises a conductive layer and a film positioned adjacent to the conductive layer. The film comprises a polymer composition that includes a liquid crystalline polymer and a hydrophobic material. The polymer composition exhibits a dielectric constant of about 5 or less and dissipation factor of about 0.05 or less at a frequency of 10 GHz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.