Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
US11917768B2 · kind B2 · utility
0Cited by
11References
3Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 25, 2022 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | May 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1423
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer circuit board, successively constituted by surface sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, surface sticking layer, said multi-layer circuit board is provided with a hole, a hole wall of said hole is formed with conductive seed layer, and partial outer surface of said surface sticking layer is formed with a circuit pattern layer of conductive seed layer, wherein said conductive seed layer comprises a ion implantation layer implanting below the hole wall of said hole and below partial outer surface of said surface sticking layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.