Method for fabricating asymmetric board
US11917769B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Mar 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present application relates to the technical field of circuit board fabricating, and provides a method for fabricating an asymmetric board, the method includes fabricating a master board, fabricating a second sub-board, thermal compression bonding the master board and the second sub-board, and milling an asymmetric board; further includes at least one of the following three steps: laying copper on the connection areas of the master board except for the second copper layer of an outermost layer to obtain laying copper area, removing copper on the connection areas of the third copper layer, and after the step of milling the asymmetric board, on each of the sub-boards, performing depth control milling at the connection areas from a side of the second sub-board on each sub-board to obtain a depth control groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.