Thermal control for processor-based devices
US11917790B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2020 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Feb 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.