Localized immersion cooling enclosure
US11917793B2 · kind B2 · utility
0Cited by
7References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Mar 8, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.