Heat sink for liquid cooling
US11917796B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2020 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Nov 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.