System and method for cooling high power electrical systems
US11917799B2 · kind B2 · utility
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3References
20Claims
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Key dates
| Filing date | Dec 20, 2021 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Dec 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments included herein are directed towards an apparatus and method for manufacturing an electrical cooling apparatus. The method may include forming a first entirely solid metal plate to generate an enclosure. The method may also include affixing a bottom metal plate to the first entirely solid metal plate, the bottom metal plate may define a channel system. The bottom metal plate may include one or more inlet openings into the channel system, where the one or more inlet openings are configured to allow coolant to enter or exit the channel system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.