Dual applicator fluid dispensing methods and systems
US11919020B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2022 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Nov 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67333
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods of dispensing fluid are disclosed. A first applicator is positioned above a first dispense site at a first dispense region of a first electronic substrate by moving the first applicator using a primary positioner. A second applicator is simultaneously positioned above a first dispense site at a second dispense region of the first electronic substrate by moving the second applicator together with the first applicator using the primary positioner and moving the second applicator relative to the first applicator using a secondary positioner. It is then determined that the first or the second dispense region is misaligned relative to the other of the first or the second dispense region. Fluid is dispensed from the first applicator while moving the first applicator using the primary positioner to form a first fluid pattern at the first dispense region and fluid is simultaneously dispensed from the second applicator while moving the second applicator using the primary positioner and the secondary positioner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.