Patent · US Active

Bamboo chip integrated material and manufacturing method thereof

US11919192B2 · kind B2 · utility

0Cited by
1References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 18, 2019
Grant dateMar 5, 2024
Priority date
Expiry dateMar 3, 2041

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2605/08
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

The invention discloses a bamboo chip integrated material. The bamboo chip integrated material is formed by a plurality of lengthened bamboo chips which are glued and overlaid; each lengthened bamboo chip is formed by a plurality of bamboo chip units which sequentially and continuously mesh and are butted; sharp teeth and grooves are formed in the two ends in the length direction of the bamboo chip units, wherein the sharp tooth of each bamboo chip unit and the groove of the corresponding bamboo sheet unit are matched to form a meshing butt-joint part, and the meshing butt-joint parts of the adjacent lengthened bamboo chips are arranged in a staggered mode; and each bamboo chip unit has a thickness of 4-12 mm and a width of 15-50 mm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.