Techniques for improved additive fabrication on a film surface and related systems and methods
US11919228B2 · kind B2 · utility
0Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2021 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Dec 21, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y50/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
According to some aspects, techniques are provided to mitigate challenges with additive fabrication devices that utilize a film. These techniques include: improvements to an additive fabrication device build platform to more evenly apply forces onto the film; techniques for inhibiting adhesion between a pair of films and for removing dirt or dust therein; techniques for detecting and/or mitigating the effects of scratches or dust on films; and techniques for detecting film punctures, detecting an imminent film puncture, and/or reducing the impact on the device when punctures occur.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.