Resin substrate having dielectric characteristics with little frequency dependence
US11920011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2022 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Jan 20, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is a resin substrate including an organic resin and a quartz glass cloth, where the organic resin has a dielectric loss tangent of 0.0002 to 0.0020 measured at 10 GHz and a 40 GHz/10 GHz ratio is 0.4 to 0.9, the quartz glass cloth has a dielectric loss tangent of 0.0001 to 0.0015 measured at 10 GHz and a 40 GHz/10 GHz ratio is 1.2 to 2.0, and the resin substrate has a dielectric loss tangent of 0.0001 to 0.0020 at 10 GHz and a 40 GHz/10 GHz ratio is 0.8 to 1.2. This provides a resin substrate having a low dielectric loss tangent in a high-frequency region and dielectric characteristics with little frequency dependence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.