Sealing compositions for water soluble films and methods of using
US11920014B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Apr 19, 2018 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Jan 10, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A sealing composition for use in unit dose packages is provided, including: 70 to 98 wt % water; 1 to 30 wt % of a hydrogen bonding component; and 1 to 30 wt % of a complex forming component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.