Patent · US Active

Dual loop lubrication and thermal management system for pumps

US11920585B1 · kind B1 · utility

0Cited by

3References

20Claims

0Family size

Assignee

EKU POWER DRIVES GMBH · US

Inventors

Levi Wayne BECK · Spring, US
Benedikt Peter Zier · Echterdingen, DE
Andreas Pfister · Munich, DE

Key dates

Filing date	Sep 1, 2022
Grant date	Mar 5, 2024
Priority date	—
Expiry date	Sep 1, 2042

Classification

Technology area (CPC F)Mechanical Engineering; Lighting; Heating
CPC primaryF04B2205/06
WIPO fieldEngines, pumps, turbines
WIPO sectorMechanical engineering

Abstract

A device including a reservoir configured to receive a lubricant from a machine lubricated with the lubricant. The device also includes a pressure equalizer connected to the reservoir. The device also includes a first loop comprising a first line system through which the lubricant flows between the machine and the reservoir. The lubricant within the first loop is at a first pressure. The device also includes a temperature regulation system configured to regulate a temperature of the lubricant. The device also includes a second loop comprising a second line system through which the lubricant flows between the temperature regulation system and the reservoir. The lubricant within the second loop is at a second pressure that is less than the first pressure. The second loop is separate from the first loop.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.