LED curing apparatus and cooling module
US11920774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2023 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Feb 1, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21V29/717
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A cooling module, which is securable to one or more thermal transfer members for an LED curing apparatus, wherein the cooling module comprises a first finned heat sink and a second finned heat sink; wherein the first finned heat sink is removably securable to the second finned heat sink to provide at least one aperture therebetween, wherein each of a plurality of fins protrude from the first finned heat sink and from the second finned heat sink and each fin is substantially perpendicular to the length of the or each aperture, wherein the first finned heat sink is removably secured proximal to the second finned heat sink by at least one locking member, and wherein the or each locking member is inserted such that its length is parallel to the length of the or each aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.