Micro hemispherical resonator gyroscope, and an assembly method and wafer fixture

US11920932B2 · kind B2 · utility

Assignee

• NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY · CN

Inventors

• Xuezhong Wu · Bellevue, US
• Dingbang Xiao · Changsha, CN
• Xiang Xi · Changsha, CN
• Yulie Wu · Changsha, CN
• Hanhui He · Changsha, CN
• Yan Shi · Nanhu, CN
• Kun Lu · Richardson, US
• Bin Li · Beijing, CN
• Yimo Chen · Changsha, CN
• Chao Yuan · Plainsboro, US
• Bao Nie · Changsha, CN

Key dates

• Filing date: Sep 17, 2020
• Grant date: Mar 5, 2024
• Expiry date: Nov 20, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G01C19/5783
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate. The wafer-level assembly method includes: fixedly mounting the plurality of independently manufactured micro hemispherical resonators on the same wafer fixture to implement a wafer-level installation operation.