Apparatus and method for dynamic thermal management using frequency clamping and idle injection
US11921554B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2022 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Apr 12, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an apparatus for dynamic thermal management, which includes a thermal management unit that determines whether there is a need to perform thermal management on a processor based on temperatures measured from a plurality of temperature sensors included in the processor and generates an indication signal, and a controller that performs the thermal management on the processor in response to the indication signal, by using a first method of adjusting a state of each of a plurality of cores included in the processor, a second method of adjusting a level of an operating voltage and a frequency of a clock signal, which are provided to the processor, and/or a third method for adjusting only the frequency of the clock signal to be provided to the processor, and where each of the plurality of cores is in a wake-up state or an idle state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.