Fingerprint sensor package and sensor package
US11922718B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 23, 2022 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | May 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensor package may include a film substrate, an interconnection substrate on the film substrate, a semiconductor chip on the interconnection substrate, a conductive structure on the interconnection substrate and laterally isolated from direct contact with the semiconductor chip, and an interposer substrate on the semiconductor chip and the conductive structure. The conductive structure may include first and second conductive structures, which are electrically separated from each other. The interposer substrate may include a first sensing pattern electrically connected to the first conductive structure and a second sensing pattern on a top surface of the first sensing pattern and electrically connected to the second conductive structure. The second sensing pattern may be vertically isolated from direct contact with from the first sensing pattern. The second sensing pattern may have a longitudinal axis parallel to a direction crossing a longitudinal axis of the first sensing pattern, in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.