Substrate-type multi-layer polymer capacitor (MLPC) having electroplated terminal structure
US11923148B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2022 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Sep 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G11/48
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate-type multi-layer polymer capacitor (MLPC), including a casing, a core, a first electroplated terminal and a second electroplated terminal. The core is arranged in an inner cavity of the casing. The casing is formed by joining two first packaging plates with two second packaging plates. The first and second electroplated terminals are formed by electroplating. The first electroplated terminal is configured to cover one end of the casing to form an anode electrically led out from the core, and the second electroplated terminal is configured to the other end of the casing to form a cathode electrically led out from the core. The first packaging plate includes a substrate, an electrode plate and two metal plates. The first and second electroplated terminals are integrally sealed with the casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.