Carrier, assembly with a carrier, and method for producing a carrier
US11923303B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2019 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Aug 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier comprises: a main body made of a material comprising a thermal conductivity of at least 380 W/(m K), wherein the main body comprises a mounting surface for mechanical and thermal connection with a component, wherein the main body comprises a recess which penetrates the main body along a first direction perpendicular to the main extension plane of the main body, an electrically insulating filler is arranged in the recess, which comprises a further recess penetrating the filler along the first direction, an inner wall of the filler surrounding the further recess is provided with an electrically conductive coating to form a via through the main body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.