Deformable array of semiconductor devices

US11923472B2 · kind B2 · utility

Assignee

• The United States of America as represented by the Secretary of the Army · US

Inventors

• Sabrina M. Curtis · Silver Spring, US
• Haotian Wang · Palo Alto, US
• Gabriel P. Anfinrud · Rockville, US
• Alexander O. Randolph · Madison, US
• Gabriel L. Smith · Ellicott City, US
• Nathan S. Lazarus · Pittsburgh, US

Key dates

• Filing date: Oct 30, 2019
• Grant date: Mar 5, 2024
• Expiry date: Jul 8, 2040

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

A deformable array of semiconductor devices, and a method of manufacturing such a deformable array. The deformable array comprises a plurality of islands, where each island contains at least one semiconductor device, and the plurality of islands are arranged in an auxetic geometry.