Method for producing an optoelectronic device

US11923487B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Gregory Bellynck · Donaustauf, DE
• Ivar Tangring · Regensburg, DE

Key dates

• Filing date: Dec 3, 2019
• Grant date: Mar 5, 2024
• Expiry date: Mar 18, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8515

Abstract

In an embodiment a method includes providing a carrier with an optoelectronic semiconductor chip-component arranged on a top side of the carrier, arranging a first potting material on the top side of the carrier, arranging a second potting material on the first potting material, wherein the second potting material comprises a higher density than the first potting material, wherein a top side of the optoelectronic semiconductor chip-component is covered by neither the first potting material nor the second potting material and allowing a force to act on the first potting material and the second potting material such that the second potting material migrates in a direction toward the top side of the carrier.