Butt joint flex circuit board interconnection
US11923628B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2021 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | May 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/80
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Interconnections for connecting flex circuit boards in classical and/or quantum computing systems can include a first flex circuit board having a removed portion that exposes one or more signal lines and a second flex circuit board having a removed portion that exposes one or more other signal lines. The flex circuit boards can be aligned at the removed portions to form a signal trace gap near the exposed signal lines. Exposed signal lines of the first flex circuit board can be coupled with exposed signal lines of the second flex circuit board. A ground support layer can be coupled to the first flex circuit board and the second flex circuit board along the same side. An isolation plate at least partially covering the signal trace gap can be coupled to the first flex circuit board and/or the second flex circuit board on a side opposite of the ground support layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.