Printed circuit board (PCB) including heatsinks
US11924962B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 21, 2021 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Apr 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/116
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB), including: a processing unit; a plurality of layers; and a plurality of vias, each via extending through two or more of the layers, wherein a first via of the plurality of vias has a first pad at a first layer of the plurality of layers and a second via of the plurality of vias has a second pad at the first layer of the plurality of layers, wherein the first pad is conjoined with the second pad to form a first heatsink at the first layer that dissipates heat away from the processing unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.