Hybrid immersion cooling system for rack-mounted electronic assemblies
US11924998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2022 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Mar 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed systems and structures are directed to providing a hybrid liquid-cooling system for at least one rack-mounted immersion case containing at least one electronic assembly submerged in dielectric immersion cooling liquid. The hybrid liquid cooling system comprises a closed-loop fluid distribution arrangement configured to circulate channelized fluid, an external cooling module configured to thermally condition the channelized fluid circulated by the closed-loop fluid distribution arrangement, a serpentine convection coil structured to internally convey channelized fluid to operatively cool ambient temperatures of the dielectric immersion cooling liquid, and one or more fluid cooling blocks arranged to be in direct thermal contact with one or more heat-generating electronic processing components of the at least one electronic assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.