Methods and apparatus for embedding heating circuits into articles made by additive manufacturing and articles made therefrom
US11926093B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2021 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Mar 15, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y80/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods of embedding a heating circuit in an article fabricated by additive manufacturing. The methods describe techniques such as co-extruding a wire, capable of being heated, along with print material in additive manufacturing of the article, and placing a pre-shaped wire capable of being heated between adjacent layers of the article. A third method includes dispensing a wire, capable of being heated, during the additive manufacturing of the article, and compacting the wire into the printed material. An apparatus for embedding a heating circuit in an article fabricated by additive manufacturing. The apparatus contains a wire dispenser, a cutter to control the length of the wire dispensed, and a compactor capable of embedding the wire capable of being heated into the printed material. An article made by additive manufacturing is disclosed. The article contains at least one heating element embedded in the article during the additive manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.