MDO thermoresistant heat-shrinkable multilayer film
US11926117B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Nov 24, 2017 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Nov 24, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to an MDO thermoresistant heat-shrinkable multilayer film of a copolymer polyester having excellent thermal resistance. In particular, the present invention provides an MDO thermoresistant heat-shrinkable multilayer film that includes multiple skin layers capable of improving thermal resistance formed on a substrate layer capable of providing high shrinkage, and simultaneously has excellent thermal resistance and high shrinkage properties through MD orientation instead of the conventional TD orientation method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.