Hollow resin particles and sheet
US11926763B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Mar 25, 2019 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Jul 13, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02A50/20
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is hollow resin particles having higher compressive strength and more excellent heat insulating properties and heat resistance than before. The hollow resin particles each having one or two or more hollow portions, wherein a number average particle diameter is from 0.1 μm to 9.0 μm, a void ratio is from 70% to 99%, and an amount of the volatile organic compound contained is 5% by mass or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.