Activating surfaces for subsequent bonding
US11926768B2 · kind B2 · utility
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4References
27Claims
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Key dates
| Filing date | Jun 7, 2021 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Jul 2, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2481/008
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of activating a surface of a plastics substrate formed from: for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:includes radiation with wavelength in the range from about 10 nm to about 1000 nm;the energy of the actinic radiation to which the surface is exposed is in the range fromabout 0.5 J/cm2 to about 300 J/cm2.Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.