Copper alloy plate, copper alloy plate with plating film, and methods for producing these
US11926889B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2020 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Aug 5, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A copper alloy plate containing in a center part of a plate thickness direction more than 2.0% (% by mass) and 32.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.1% of Fe, and 0.005% or more and 0.1% or less of P; and the balance Cu, including a surface layer part in which a surface Zn concentration in a surface is 60% or less of a center Zn concentration in the center part, having a depth from the surface to where Zn concentration is 90% of the center Zn concentration; and in the surface layer, the Zn concentration increases from the surface toward the center part in the plate thickness direction at a concentration gradient of 10% by mass/μm or more and 1000% by mass/μm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.