Measurement machine and method for detecting a defect in solder joints
US11927436B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2021 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Sep 8, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/95669
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.