Patent · US Active

Computer implemented method of and optimisation tool for refinement of laser cutting processing parameters by means of an optimization tool

US11927927B2 · kind B2 · utility

0Cited by
3References
14Claims
0Family size

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Key dates

Filing dateAug 18, 2021
Grant dateMar 12, 2024
Priority date
Expiry dateAug 18, 2041

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06N20/10
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

The present disclosure relates to a method of calculating process parameters. which are optimized for processing a workpiece with specific material properties by means of a laser machine, comprising the method steps of: determining material properties for which the process parameters should be optimized; determining preconfigured initial process parameters; executing a re-optimization algorithm until a target objective function is minimized or maximized for calculating optimized material-specific process parameters by accessing a storage with a statistical model, wherein the statistical model is based on Bayesian optimization using Gaussian Processes as priors.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.